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Browsing Posts tagged module

Industry’s Most Compact Package Size.
Sharp Corporation has developed the new PQ5CM03 DC-DC converter module with integrated coil that features the industry’s most compact package size (9.0 x 6.0 x 2.6 [H] mm).

Electronic equipment such as LCD TVs and Blu-ray Disc recorders incorporate a variety of DC-powered devices to improve performance and reduce energy consumption, and manufacturers are demanding more compact size and greater conversion efficiency of the DC-DC converters that convert between these DC (direct current) voltages.

I am generally writing linux drivers for embedded systems for three years, and I am using this sample driver interface for the startup. In this blog entry I will give steps for sample linux driver implementation and sample files.
First of all we need a “mydriver.h” for header definitions,

#ifndef __LOADYOURSELF_MYDRIVER__
#define __LOADYOURSELF_MYDRIVER__

///@file mydriver.h
///@brief mydriver header file for mydriver.

#ifndef __KERNEL__
# define __KERNEL__
#endif
#ifndef MODULE
# define MODULE
#endif

NEC LCD Technologies, together with its sales and marketing channels in the Americas and Europe, NEC Electronics America, Inc., and NEC Electronics (Europe) GmbH, introduced a new 9.0-inch (23 centimeters diagonal) amorphous-silicon thin-film-transistor (TFT) liquid crystal display (LCD) module, part number NL8048BC24-04, with wide video graphics array (WVGA) resolution for industrial equipment, including factory automation and measurement equipment.
The new module incorporates NEC LCD Technologies’ proprietary ultra-advanced, super-fine TFT (UA-SFT) technology that enables superior viewing angles without compromising brightness or color gamut. In addition, the module has been designed with wide-format resolution to meet the rising demand for such in various industrial applications.

MasterCard Worldwide and Toshiba Corporation announced the launch of MasterCard PayPass™ enabled chip module. PayPass is a contactless payment feature developed and deployed globally by MasterCard. With this collaboration MasterCard and Toshiba plan to introduce the chip module in Japanese market by the end of 2008.Designed using globally interoperable standards (ISO/IEC7816 and ISO/IEC14443), the chip module will be enabled with dual interface (EMV contact / PayPass contactless). The price gap will be kept to the minimum from the single EMV contact interface chip so that companies who currently adopt and deploy EMV contact chip can easily add and issue PayPass enabled cards with costs saved.

For MasterCard customer companies, adoption of the chip module is easy, as it is enabled with M/chip 2, which is the most accepted version of M/Chip (application for IC card of MasterCard) among MasterCard customer companies in Japan.

Since its first launch in 2002,PayPass continues to gain strong momentum worldwide.

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#include

current->state = TASK_INTERRUPTIBLE;
#if LINUX_VERSION_CODE >= 0x02017F

schedule_timeout(20 * HZ / 1000);
#else
current->timeout = jiffies + 20 * HZ / 1000; // 20 ms
schedule();
#endif

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